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1/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. cmos ldo regulators fo r port a b le equipment s 1ch 150ma cmos ldo regulators bh nb1w hfv s e ries description the bh nb1whfv series is a line of 150 ma output, high-perfo rmance cmos regulators that deliver a high ripple rejection ratio of 80 db (typ., 1 khz). they are ideal for use in high-performance, analog applic ations and offer improved line regulation, load regulation, and noise characteristics. using the ultra-small hvsof5 package, which features a built-in heat sink, contributes to space-saving application designs. f eat ures 1) high accuracy output voltage: 1% 2) high ripple rejection ratio: 80 db (typ., 1 khz) 3) stable with ceramic capacitors 4) low bias current: 60 a 5) output voltage on/off control 6) built-in overcurrent and thermal shutdown circuits 7) ultra-small hvsof5 power package ap pli c ati ons battery-driven portable devices, etc. pro duct l i n e ? 150 ma bh nb1whfv series product name 2.5 2.8 2.85 2.9 3.0 3.1 3.3 package bh nb1whfv hvsof5 model name: bh nb1w a b symbol description a output voltage specification output voltage (v) output voltage (v) 25 2.5 v (typ.) 30 3.0 v (typ.) 28 2.8 v (typ.) 31 3.1 v (typ.) 2j 2.85 v (typ.) 33 3.3 v (typ.) 29 2.9 v (typ.) b package hfv: hvsof5 no.11020ebt04 downloaded from: http:///
technical note bh nb1w hfv s e ries 2/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. abs o lute maxim u m ratings parameter symbol ratings unit applied power supply voltage vmax ? 0.3 to +6.0 v power dissipation pd 410 *1 mw operating temperature range topr ? 40 to +85 c storage temperature range tstg ? 55 to +125 c *1: reduce by 4.1 mw/ ? c over 25 ? c, when mounted on a glass epoxy pcb (70 mm ? 70 mm ? 1.6 mm). re comm en de d o per atin g ran g e s (not to e x c e e d pd) parameter symbol ratings unit power supply voltage v in 2.5 to 5.5 v output current i out 0 to 150 ma re comm en de d o per atin g co nd iti ons parameter symbol ratings unit conditions min. typ. max. input capacitor c in 0.1 *2 f the use of ceramic capacitors is recommended. output capacitor c o 2.2 *2 f the use of ceramic capacitors is recommended. *2 make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, dc b ias characteristic. and also make sure that the capacitor value cannot change as time progresses. electrical character i stics (unless otherwise specified, ta = 25c, v in = v out + 1.0 v, stby = 1.5 v, c in = 0.1 f, c o = 2.2 f) parameter symbol limits unit conditions min. typ. max. output voltage v out v out ? 0.99 v out v out ? 1.01 v i out = 1 ma circuit current ignd 60 100 a i out = 50 ma circuit current (stby) istby 1.0 a stby = 0 v ripple rejection ratio rr 80 db vrr = ? 20 dbv, frr = 1 kz, i out = 10 ma load response 1 ltv1 25 mv i out = 1 ma to 30 ma load response 2 ltv2 25 mv i out = 30 ma to 1 ma dropout voltage 1 vsat1 80 150 mv v in = 0.98 ? v out , i out = 30 ma dropout voltage 2 vsat2 250 450 mv v in = 0.98 ? v out , i out = 100 ma line regulation vdl1 1 20 mv v in = v out + 0.5 v to 5.5 v, i out = 50 ma load regulation 1 vdlo1 6 30 mv i out = 1 ma to 100 ma load regulation 2 vdlo2 9 90 mv i out = 1 ma to 150 ma overcurrent protection limit current ilmax 250 ma v o = v out ? 0.98 short current ishort 50 ma v o = 0 v stby pull-down resistance rstb 275 550 1100 k stby control voltage on vstbh 1.5 v in v off vstbl ? 0.3 0.3 v * this ic is not designed to be radiation-resistant. downloaded from: http:///
technical note bh nb1w hfv s e ries 3/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. ref e re nce data fig.1 output voltage vs input voltage (bh25nb1whfv) fig.5 gnd current vs input voltage (bh30nb1whfv) fig.6 gnd current vs input voltage (BH33NB1WHFV) fig.7 output voltage vs output current (bh25nb1whfv) fig.8 output voltage vs output current (bh30nb1whfv) fig.9 output voltage vs output current (BH33NB1WHFV) fig.10 dropout voltage vs output current (bh25nb1whfv) fig.11 dropout voltage vs output current (bh30nb1whfv) fig.12 dropout voltage vs output current (BH33NB1WHFV) 0. 0 0. 5 1. 0 1. 5 2. 0 2. 5 3. 0 3. 5 4. 0 012345 input voltage vin[v] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 in pu t v olt ag e vin[ v] o ut pu t v o lt ag e vo ut[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 input voltage vin[v] o ut pu t v o lt ag e vo ut[v] 0 10 20 30 40 50 60 70 80 012345 input voltage vin[v] gnd current ignd[ma] 0 10 20 30 40 50 60 70 80 012345 in pu t vo ltag e vi n[v] gnd current ignd[ma] 0 10 20 30 40 50 60 70 80 01 23 45 input voltage vin[v] gnd current ignd[ma] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 50 100 150 200 250 300 output current iout[ma] o ut pu t v olt ag e vo ut[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 50 100 150 200 250 300 ou tp ut cu rre nt io ut [ma] output voltage vout[v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 50 100 150 200 250 300 outp ut cu rrent io ut [ma] output voltage vout[v] 0. 0 0. 1 0. 2 0. 3 0. 4 0. 5 0 50 100 150 output current i out[ma ] dropout voltage vsat[v] 0.0 0.1 0.2 0.3 0.4 0.5 05 01 0 01 5 0 outp ut cu rrent iout[ ma] dropout voltage vsat[v] 0.0 0.1 0.2 0.3 0.4 0.5 0 50 100 150 output current iout[ma] dropout voltage vsat[v] fig.2 output voltage vs input voltage (bh30nb1whfv) fig.3 output voltage vs input voltage (BH33NB1WHFV) fig.4 gnd current vs input voltage (bh25nb1whfv) downloaded from: http:///
technical note bh nb1w hfv s e ries 4/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. 2.40 2.45 2.50 2.55 2.60 -5 0 - 25 0 2 5 5 0 75 10 0 temp[ ] output voltage vout[v] 2.90 2.95 3.00 3.05 3.10 -50-25 0 255075100 temp[ ] ou tpu t vo ltag e vo ut[v ] 3.20 3.25 3.30 3.35 3.40 -50 -25 0 25 50 75 100 temp[ ] output voltage vout[v] 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m fig.19 load response (co = 2.2 f) (bh25nb1whfv) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.20 load response (co = 2.2 f) (bh30nb1whfv) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.21 load response (co = 2.2 f) (BH33NB1WHFV) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.22 output voltage rise time (bh25nb1whfv) stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f fig.23 output voltage rise time (bh30nb1whfv) fig.24 output voltage rise time (BH33NB1WHFV) stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f fig.13 output voltage vs temperature (bh25nb1whfv) fig.14 output voltage vs temperature (bh30nb1whfv) fig.15 output voltage vs temperature (BH33NB1WHFV) fig.16 ripple rejection (bh25nb1whfv) fig.17 ripple rejection (bh30nb1whfv) fig.18 ripple rejection (BH33NB1WHFV) iout=1ma iout=1ma co=2.2 f io=10ma iout=1ma 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m co=2.2 f io=10ma 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m co=2.2 f io=10ma downloaded from: http:///
technical note bh nb1w hfv s e ries 5/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. bl ock di agr am, rec o mme nde d circ uit d i a g ra m, and pi n assi gnm ent d i a g ra m pin no. symbol function 1 stby output voltage on/off control (high: on, low: off) 2 gnd ground 3 v in power supply input 4 v out voltage output 5 n.c. no connect po w e r di ssip a ti on (pd ) 1. power dissipation (pd) power dissipation calculations include estimates of power dissi pation characteristics and internal ic power consumption, and should be treated as guidelines. in the event that the ic is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the therma l shutdown circuit, reducing the current capacity and otherwise degrading the ic's design performance. allo w for sufficient margins so that this power dissipation is not exceeded during ic operation. calculating the maximum internal ic power consumption (p max ) p ma x = (v in ? v out ) ? i out ( m ax .) v in : input voltage v out : output voltage i out (max): max. output current 2. power dissipation/power dissipation reduction (pd) hvsof5 *circuit design should allow a sufficient margin for the temperature range so that pmax < pd. i n put output cap a citors it is recommended to insert bypass capacitors between inpu t and gnd pins, positioning them as close to the pins as possible. these capacitors will be used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the ic has been mounted. ceramic capacitors generally have temperature and dc bias char acteristics. when selecting ceramic capacitors, use x5r or x7r, or better models that offer good temperature and dc bias characteristics and high tolerant voltages. typical ceramic capacitor characteristics 0 20 40 60 80 100 120 01234 dc bias vdc[v] capacitance rate of change [%] 70 75 80 85 90 95 10 0 01234 dc bias vdc[v] capacitance rate of change [%] 0 20 40 60 80 10 0 12 0 -25 0 25 50 75 temp[ ] ca pa cita nc e ra te o f ch an g e [%] 50 v tol e r ance 16 v t o l e r ance 10 v tol e r ance 50 v t o l e r ance 16 v t o l e r ance 10 v tol e r ance y5 v x7 r x5 r fig.27 capacitance vs bias (y5v) fig.28 capacitance vs bias (x5r, x7r) fig.29 capacitance vs temperature ( x5r, x7r, y5v ) 0 0.2 0.4 0.6 0 25 50 75 100 125 ta[ ] pd[w] board: 70 mm ? 70 mm ? 1.6 mm material: glass epoxy pcb 410 mw fig. 26 hvsof5 power dissipation/pow er dissipation reduc tion (example) fig.25 cin ? ? ? 0.1f co ? ? ? 2.2f bh nb 1whfv thermal protection over current protection voltage reference control block vout n.c. vin vin cin gnd stby vstb vout co 3 2 1 5 4 downloaded from: http:///
technical note bh nb1w hfv s e ries 6/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. o u tput cap a cit o rs mounting input capacitor between input pin and gnd(as close to pin as possible), and also output capacitor between output pin and gnd(as close to pin as possible) is recommended. t he input capacitor reduces the out put impedance of the voltage supply source connected to the vcc. the higher value the output capacitor goes, the more stable the whole operation becomes. this leads to high load transient response. please confirm the whole operation on actual application board. generally, ceramic capacitor has wide range of tolerance, tem perature coefficient, and dc bias characteristic. and also its value goes lower as time progresses. please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers. bh nb 1whfv o per atio n not e s 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. 3. inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. 4. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit is designed only to shut the ic off to prevent r unaway thermal operation. it is not designed to protect the ic or guar antee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. 5. overcurrent protection circuit the ic incorporates a built-in overcurrent protection circuit that operates accordi ng to the output current capacity. this circuit serves to protect the ic from dam age when the load is shorted. the protecti on circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in ap plications characterized by the contin uous operation or transitioning of the protection circuits. at the time of thermal designing, keep in mind that the current capab ility has negative characteristics to temperatures. 6. action in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic fiel d as doing so may cause the ic to malfunction. 7. ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 0.01 0.1 1 10 100 0 50 100 150 output current i out [ma] esr[ ? ] stable region fig.30 stable operation region (example) c out = 2.2 f ta = +25c downloaded from: http:///
technical note bh nb1w hfv s e ries 7/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. 8. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 9. back current in applications where the ic may be exposed to back current fl ow, it is recommended to create a path to dissipate this current by inserting a bypass diode between the vin and vout pins. 10. testing on application boards when testing the ic on an application board, connecting a capa citor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precauti on when transporting or storing the ic. 11. regarding input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with t he n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage t o an input pin, should not be used. fig.32 example of ic structure fig. 31 example bypass diode connection vin stby gnd out back current resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element downloaded from: http:///
technical note bh nb1w hfv s e ries 8/8 www.rohm.com 201 1.01 - rev . b ? 2011 rohm co., ltd. all rights reserved. or der in g p a rt num be r b h 2 5 n b 1 w h f v - t r part no. output voltage 25:2.5 v 28:2.8 v 2j:2.85 v 29:2.9 v 30:3.0 v 31:3.1 v 33:3.3 v series nb1 : high ripple rejection shutdown switch w : includes switch package hfv : hvsof5 packaging and forming specification tr: embossed tape and reel (unit : mm) hvsof5 s 0.08 m 0.1 s 4 321 5 (0.05) 1.6 0.05 1.0 0.05 1.6 0.05 1.2 0.05 (max 1.28 include burr) 45 32 1 (0.8) (0.91) (0.3) (0.41) 0.2max 0.13 0.05 0.22 0.05 0.6max 0.5 0.02 +0.03C0.02 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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